Abstract
New approaches to manufacturing improved combined boards on aluminum bases with various thin polyimide dielectrics, including thermally conductive ones, foiled by copper or aluminum foil have been proposed.
 Design and technological solutions and methods for manufacturing combined printed circuit boards on aluminum bases using industrial thin thermally conductive polyimide dielectric films with fluoropolymer coatings with thermal conductivity from 0,12 to 0,46 W/(m·K) have been developed. Design and technological solutions and methods for manufacturing combined printed circuit boards on thermally conductive aluminum bases using adhesive-free copper-polyimide and aluminum-polyimide lacquer foil dielectrics with thermal conductivity of varnish polyimide layers from 0,12 up to 1,0 W/(m·K) and more have been developed.
 Main chemical, mechanical, electrical end thermal properties of various types of experimental combined printed circuit boards on aluminum bases with thin polyimide dielectrics for use in electronic modules and printed circuit assemblies (including with using Chip-on-board and Chip-on-flex technologies for assembling) have been studied.
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