Abstract
We newly developed a negative photo-definable polyimide dry films with higher photoreactivity than conventional ones. We succeeded in fine and high aspect ratio patterning with 90 μm thickness and 8 μm width by using new polyimide dry films. When compared after curing, the tensile breaking strength and share strength of new and conventional polyimide dry films were almost the same. However, when compared after PEB and exposure, the new ones showed clearly higher properties than conventional one. Using this polyimide dry film as an inter-layer dielectrics or a permanent resist was effective in improving the wiring density of electric devices.
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