Abstract
Fatigue tests were performed using single lap-joint specimens to obtain near-threshold fatigue crack growth data of solder joint under mode-II load. Attention was focused on the effect of high temperature aging and microstructures separately from the intermetallics. As a result, it was shown that the long cast time yielded the intermetallics and microstructures of the solder invariable regardless of aging condition. The granular micro-structure of the air-cooled specimens was shown to be inferior to the laminated micro-structure of the furnace-cooled specimens. Also, transition of fatigue crack behavior with ΔJ and the procedure of fatigue crack propagation from the pre-crack tip were discussed.
Published Version
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