Abstract
We report the optimization of electron beam lithography and inductively coupled plasma (ICP) dry etching processes to fabricate pre-patterned Si (100) substrates with sub-100nm holes with controlled size and shape. An efficient in situ cleaning sequence based on atomic hydrogen cleaning at 500^oC combined with thermal oxide desorption at 750^oC confirmed by reflection high energy electron diffraction (RHEED) pattern of two dimensional clean surface prior to the MBE growth has been established. The MBE growth of GaAs/In0.15Ga0.85As/GaAs system on patterned Si surface has shown highly selective formation of localized dome like nanostructures in patterned holes with [email protected] period.
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