Abstract
Coupling the imprint mold structure having a self-assembled monolayer (SAM) and a buffer oxide layer (BOL) with a poly(vinyl alcohol) (PVA) resin is investigated for thermal nanoimprint lithography on flexible substrates. The mold structure is SAM/BOL/Cr. Among the buffer oxides tested (SiO2, Al2O3, HfO2), SiO2 results in the most hydrophobic character at the SAM surface of the mold. Water-soluble PVA resin is shown to be an excellent pattern transfer layer due to its clean release from the hydrophobic mold and strong barrier to SF6 etching during subsequent substrate patterning. The combination of SAM/SiO2/Cr mold structure with PVA resin is demonstrated to produce high quality, defect-free nanopatterns on both rigid silicon and flexible poly(ethylene terephthalate) and polyimide substrates.
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