Nanoscale metal-silicide films prepared by surfactant sputtering and analyzed by RBS

Abstract

Surfactant sputtering has been applied to modify the surface structure of Si substrates and to produce ultrathin metal-silicide films with nickel and platinum surfactants, utilizing the steady state coverage of a Si-substrate surface with surfactant atoms simultaneously during sputter erosion by combined ion irradiation and surfactant atom deposition. Si (1 0 0) substrates were eroded using 5 keV Xe-ions and 10–30 keV Ar ions at incident angles of 65° and 70° with fluences of up to 2 × 10 18 /cm 2 under continuous sputter deposition of platinum and nickel from targets irradiated simultaneously by the same ion beam. These surfactant atoms form metal-silicides in the surface near region and strongly modify the substrate sputter yield and the surface nanostructure. Atomic force microscopy and scanning electron microscopy were carried out to observe a transition of surface topography from ripple to relief patterns, granular patterns or smooth surfaces. The Si and metal sputter yield as function of the steady state metal coverage were determined by combination of Rutherford-backscattering spectroscopy (RBS) and profilometry. The composition and the depth distributions of metal-silicide films were analyzed via high-resolution RBS and transmission electron microscopy. We show that RBS results in comparison with SRIM and TRIDYN sputter yield simulations allows us to identify the silicide surface structure on the nanometer scale.