Abstract
The study of metal–metal interactions is both interesting and of technological importance for various thin-film structures. We carried out surface elemental analysis of several metal-plated films using magnetic-force-controlled atomic force microscopy (MFC-AFM) to evaluate the quality of wireless bondings and the films themselves. We reached the following two conclusions. First, the stiffness of the two types of plated metal film can be differentiated by MFC-AFM, whereby the difference in stiffness between the plated metal films can be imaged. Simultaneous imaging of the surface properties and stiffness of the samples produced by wet processes can be achieved at high resolution. Secondly, the Ni atoms that diffused to the Au-plated film surface annealed at 180 °C for 5 min can also be imaged by MFC-AFM. The relationship of these metal–metal interactions to the electronic packaging are discussed in this paper.
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