Abstract
Heat-resistance of novel mold compound made of silsesquioxane nanocomposite with silica fillers is demonstrated in a TO247 package of SiC SBD. The test specimens are exposed to thermal cycling between -50°C and 250°C, and the thermal damage of the mold are precisely evaluated by using nanoscale dynamical mechanical analysis based on nanoindentation technology. The results reveal that the excellent heat-resistance is brought by the miscibility between the thermosetting nanocomposite and silica fillers.
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