Abstract
AbstractThe continuous effort of modern electronic industry is the miniaturization of microelectronic components. In order to guarantee the reliability of the joining process, the quantitative knowledge of the solder material properties is very important, especially the values of Young's modulus, Nanoindentation hardness and yield stress. However, small‐sized microelectronic devices require the fabrication of small sized specimens and the use of corresponding miniature material tests. At the Technische Universität Berlin nanoindentation tests are applied. Moreover the material properties at elevated temperature are of particular interest in order to characterize the solder materials more detailed. This work describes the setup and the elevation of high‐temperature nanoindentation tests in context with first results for selected materials. (© 2009 Wiley‐VCH Verlag GmbH & Co. KGaA, Weinheim)
Published Version (
Free)
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call