Abstract
A novel nanocomposite resist system was developed for sub-100 nm resolution e-beam lithography by dispersing surface-treated silica nanoparticles in a commercial ZEP520 ® resist. At 4.0 wt % loading of silica nanoparticles, the system exhibited a much higher resolution than ZEP520 ® without sacrificing the intrinsic high sensitivity and contrast of the starting polymer. The first major result is that 46 nm-wide isolated lines were obtained in the nanocomposite system, whereas comparatively 130 nm-wide lines were obtained in ZEP520 ® under the same experimental conditions. Moreover, it was shown that the addition of silica nanoparticles resulted in a higher resistance of the nanocomposite to plasma etching with O 2 gas. The major resolution improvement indicates that the nanocomposite is a promising candidate resist for sub-100 nm resolution e-beam lithography.
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