Abstract
To suppress grinding-induced edge cracks in dental lithium metasilicate/disilicate glass-ceramics (LMGC/LDGC), this paper established a contact stress model for single-diamond grinding (SDG) to relate their crack generation and ductile-to-brittle transition (DBT) thresholds with the mechanical properties, diamond tool profiles and process variables. Nanoindentation, friction test and SDG were conducted to unravel material responses and dynamic diamond grit-workpiece interactions to determine the DBT thresholds. The nanoindentation revealed significant indentation size effects (ISEs) on the hardness and elastic moduli of the ceramics. SDG clearly elucidated their DBT behaviors, wherein edge cracks initiated at diamond peripheries when the concurrent contact stresses reached the DBT thresholds. Accordingly, the indicated critical cutting depths for DBT may be changed from the nanoscale to the microscale by increasing the tool radius and reducing the machining speed. This research contributes to edge crack suppression for ductile machining of brittle materials at large removal rates.
Published Version
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