N2O plasma treatment effect on reliability of p-GaN gate AlGaN/GaN HEMTs

Abstract

This work investigates the effect of N2O plasma treatment on the reliability of p-GaN gate AlGaN/GaN high-electron-mobility transistors (HEMTs), specifically in the AlGaN drift region. The formation of a GaON/AlON compound layer on the AlGaN surface after N2O plasma treatment was confirmed by energy-dispersive x-ray spectroscopy mapping and x-ray photoelectron spectroscopy analysis. When a device is under highly stressed conditions, the compound layer reduces the number of negatively charged interface traps and protects the AlGaN surface by hindering the Ga-out diffusion. The high temperature reverse bias reliability test demonstrated that the N2O plasma treatment enhanced the reliability of p-GaN gate HEMTs by suppressing the degradation of the on-resistance from 18.7% to 9.0%, after being subjected to a high drain bias (VDS = 700 V) at 200 °C for 1000 s.