Abstract
Al-Base BGA shows large bending behavior under thermal cycling. Therefore, it is important to evaluate the fatigue life of Al-Base BGA solder ball joints. The thermal cycle tests were carried out to confirm the fatigue life of solder ball joints. In addition, the mechanical fatigue tests using three-point bending method were carried out and compared with the thermal fatigue tests. On the other hand, equivalent inelastic strain range was estimated by stress-strain analysis of finite element method. The equation of fatigue life evaluation of Al-Base BGA solder ball joints was determined using Coffin-Manson's law.
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