Abstract
As for the electrodeposited silver obtained from cyanide baths for silver plating, the relation between the rectified waves of power source and the hardness of deposited silver was examined. The rectified waves used were smoothed direct current, single-phase full-wave rectification, and single-phase half-wave rectification; and their form factors were 1.00, 1.22, and 1.73, respectively. The results obtained were as follows: (1) The hardness of brightless silver platings, which had been obtained under low current density, decreased with the increase of form factor. However, no relation was observed between hardness and form factor when current density was not lower than 1amp./dm2. (2) The hardness of bright silver platings, which had been obtained under current density of 1-3amp./dm2, decreased with the increase of current density. However, no relation was observed between hardness and from factor when current density was lower than the values in the above range. (3) The hardness of brightless silver platings decreased with the rise of bath temperature. (4) The hardness of bright silver platings, which had been obtained at considerably low temperatures, decreased with the increase of form factor. However, no relation was observed between hardness and form factor at bath temperatures of not lower than 35°C. It was shown by the above facts that the balancing between crystal growth rate and electrodeposition rate depended upon bath temperature.
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