The influence of current density and bath temperature on electrodeposition of rhodium film from sulfate–phosphate aqueous solutions

Abstract

Rhodium films were electrodeposited galvanostatically on copper–zinc alloy substrates from sulfate–phosphate aqueous solutions, in order to obtain a smooth, dense, and thick Rh film for electrical contacts. The influence of current density and bath temperature on phases, crystal structure, microstructure, and deposition rate of the film was studied. The phases and crystal structure, as well as microstructure of the film were determined by X-ray diffraction and scanning electron microscopy, respectively. The results showed that the current density and bath temperature had a significant influence on electrodeposition of rhodium film. The particles or aggregates on the surface evolved from fine to coarse and large with the increase of current density and bath temperature. By adjusting the deposition conditions, the optimized current density and bath temperature were 6.4–12.7 mA cm−2 and 50 °C, respectively. The film was composed of polycrystalline phase with monometallic form. The film was uniform and dense at low current density. The thickness of the film was up to 1.38–2.1 μm. At the optimal temperature of 50 °C, the surface of the film was smooth and fine. At the same time, the electrodeposition mechanism of the film was discussed. Rhodium films were electrodeposited from sulfate–phosphate aqueous solutions. The influence of current density and bath temperature on electrodeposition of the film was studied, and at the same time, the electrodeposition mechanism of the film was addressed.