Abstract
The fabrication processes of chip-scale alkali atom vapor cells are designed, which include silicon micromachining, filling arrays of miniaturized cells with rubidium azide, hermetic packaging using anodic bonding technology, and photodecomposition of rubidium azide. The improved anodic bonding technology is demonstrated and used to improve the gastight bonding of alkali atom vapor cells to the glass/silicon/glass bonding structure. After the anodic bonding of the glass and silicon wafer is finished, an Al metal film with a certain thickness is sputtered at a certain angle at the back (i.e., the glass side) and side of the glass/silicon-bonded structure. Therefore, the electrical contact is led into the silicon wafer when a second anodic bonding is performed, and a high-quality glass/silicon/glass bonding structure is realized. Such anodic structures have great bond strength and gastight bonding of as low as 2.5×10-8Pa·m3·s-1. After gastight sealing, the cells are irradiated with ultraviolet, causing the azide to photodissociate into pure rubidium and nitrogen in situ. Rubidium optical absorption spectrum indicates that rubidium atoms are effectively sealed in the cells. It is confirmed that the process for the fabrication of the chip-scale alkali atom vapor cells is simple and feasible.
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