Abstract
The discharge characteristics in magnetron sputtering of Ni with multipolar magnetic plasma confinement (MMPC) assisted by inductively coupled plasma (ICP) were investigated. When sputtering with MMPC assisted by ICP, the current flowing into the substrate due to Ar+ ions and sputtered Ni+ ions is increased up to 46 mA, about 2.7 times that of a conventional magnetron sputtering system. The substrate current significantly increases in comparison with a conventional magnetron sputtering system as the target dc bias voltage increases. It is shown that a nickel film with the orientation of (111) plane is formed by using ICP.
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