MXene and functionalized graphene hybridized nanoflakes based silicone-oil nanofluids as new class of media for micro-cooling application

Abstract

The major challenge of the current and future miniature compact high-tech electronic devices is thermal management. Micro-scale cooling is one of the promising thermo-fluidic implications possess a great potential in this cutting-edge research area. In this research work, newly emerged MXene (Ti3C2) and functionalized graphene (f-Gr) hybrid nanoflake is implied for the first time in the preparation of Silicon oil (Si-oil) based heat transfer media (MXene:f-Gr/Si-oil hybrid nanofluid) for the micro-scale cooling application. This research concentrates on development, characterization, thermal stability and thermal properties evaluations of new class of hybrid (MXene:f-Gr/Si-oil) nanofluids of three different concentrations of MXene and f-Gr hybrid nanoflakes. The thermal conductivity of the as produced MXene:f-Gr/Si-oil hybrid nanofluids is measured (up to 250 °C) by a Transient Hot Bridge (THB) 500 (Linseis, Germany, current 5 mA, heater-power 18 mW) with Hot Point Sensor (HPS). The measurement is conducted in a newly customized designed industrial grade hotplate heat loss protection chamber with a PID controller. Viscosity is evaluated by a Rheometer with varying temperature of 25 °C from 25 to 125 °C. Optical absorbance is measure using PerkinElmer Lambda 750. The optimum thermal conductivity enhancement is acquired about ∼68% for the MXene and f-Gr hybrid nanoflakes concentration of 0.02 wt% over the pure Si-oil base fluid at 200 °C. The viscosity of MXene:f-Gr/Si-oil hybrid nanofluids is revealed to be autonomous of adding the MXene and f-Gr hybrid nanoflakes into the Si-oil base fluid. However, viscosity of hybrid nanofluid samples is decreased by ∼36% within the increase of temperature from 25 to 50 °C. MXene:f-Gr/Si-oil hybrid nanofluid sample of concentration 0.02 wt% shows the thermal stability up to ∼393 °C (∼14% enhancement over the Si-oil). This significant improvement is advantageous for the cooling of future high-tech electronic systems. This subsequently increases thermal energy acquisition which is valuable for various other applications.