Abstract
Starting from the common anode and common cathode multi-switch Si-chips, this paper focuses on the different association techniques of the two power chips on the usual substrates (DBC/IMS). The study uses 3D multiphysics COMSOL simulations to determine the best association that would allow the best electrical performance of power converters.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.