Multiple-Gate In0.53Ga0.47As Channel n-MOSFETs with Self-Aligned Ni-InGaAs Contacts

Abstract

Sub-100 nm multiple-gate In0.53Ga0.47As channel n-MOSFETs with self-aligned Ni-InGaAs contacts were demonstrated. The self-aligned Ni-InGaAs contacts were formed by using a salicide-like metallization process, which involves a reaction between Ni and In0.53Ga0.47As and selective wet etching of unreacted Ni. Ni-InGaAs contacts formed on Si-doped n++ In0.53Ga0.47As (5×1019 cm−3) source/drain show low contact resistance RC of 79 Ω·μm and sheet resistance Rsh of 43 Ω/square. With self-aligned Ni-InGaAs contacts formed on n++ In0.53Ga0.47As source and drain, the n-MOSFET exhibits low series resistance RSD of 364 Ω·μm, which is the lowest value reported for non-planar InGaAs MOSFETs to date. The multiple-gate n-MOSFET has a channel length of 50 nm and equivalent oxide thickness (EOT) of ∼3 nm, and achieves a drive current of 411 μA/μm at VD of 0.7 V and VG of 0.7 V. The device also shows a peak extrinsic transconductance Gm of 590 μS/μm at VD of 0.5 V.