Multi-objective optimization of thermal management system for multiple heat source arrays electronic chassis in a noiseless environment

Abstract

Effective thermal management of electronic chassis is currently a critical concern. A heat sink with fins and heat pipes is suggested in this paper. It is intended to handle the heat produced by numerous sources within an electronic case and enhance its functionality. The parameters have been examined and improved in order to work quietly. Response surface methodology (RSM) was employed to examine the influence of fin length, fin thickness, fin spacing and Re on the junction temperature, temperature uniformity and thermal resistance of the heat sink for a printed circuit board array (PCBA). The parameter combinations were optimized using a genetic algorithm. The results indicated that the optimal fin spacing is 11 mm, optimal length is 199 m, and optimal thickness is 2.9 mm when the Reynolds number falls within the range of 2000 ≤ Re ≤ 7000. Compared to the original fins, the combined finned heat pipe heat sink decreases the temperature of the PCBA junction by approximately 10 K, enhances the temperature uniformity by around 49 %, and diminishes the total thermal resistance by nearly 48 %. The optimal air velocity is approximately 0.41 m/s. The improved heat sink can efficiently enhance the thermal management of electronic casings.