Multilayer Glass–Ceramic/Ceramic Composite Substrates

Abstract

Multilayer ceramic packaging technology is a combination of pure ceramics and composites based on additive manufacturing, tape casting, post-processing, and sintering/co-firing. Applications and operations demand excellent thermal, dielectric and mechanical properties. Telecommunication and electronics applications need low, medium and high permittivity materials together with low dielectric loss and excellent property stability based on the latest trends in the technology. Material availability, processing and fabrication costs are other critical aspects of multilayer ceramic technology for the industrialization of products. Being environmentally benign is another aspect of bottom-up design from the materials to the device level. In this article, we give an update on the existing multilayer glass–ceramic or composite ceramic substrate and its applications in HTCC, LTCC and ULTCC together with future research, starting with a brief history of developments to date.