Multilayer Construction with Various Ceramic Films for Electronic Devices Fabricated by Aerosol Deposition

Abstract

Aerosol deposition (AD) is applicable as a fabrication technology for microstructures comprising different materials. We used this method for electronic devices that consist of ceramic films and metal electrodes. Various ceramic thick films (5–50 μm thickness), for example, Al2O3, 2MgO·SiO2, and BaTiO3, were deposited on substrates using room‐temperature aerosol deposition. The dielectric constant of BaTiO3 was 78 at 1 MHz. Multilayer constructions with ceramic films and copper electrodes were obtained using aerosol deposition and sputtering. During deposition, photoresist film masks were applied to produce patterns of ceramic films and connections between upper and lower electrodes through the ceramic films.