MOS and bipolar VLSI technologies using electron-beam lithography

Abstract

Key issues for micrometer and submicrometer MOS and bipolar device fabrication are discussed, including lithography, device and circuit scaling limitations, and process considerations. Lithographic requirements are presented in terms of an overall technology-machine, resist and pattern transfer methods-and an electron-beam alice writing technology is described which satisfies those needs. Viable micrometer and submicrometer MOS and bipolar process technologies are demonstrated by scaling complex LSI circuits to VLSI density using electron lithography. For the MOS case, scaling of static memories is discussed in detail, including fabrication of a 4K SRAM with 1.5-µm minimum feature sizes, 12-15-ns access times, and a chip size of only 6K mil2. A discussion of bipolar device and process scaling issues is highlighted by the successful fabrication of a scaled 16-bit integrated injection logic (I2L) microprocessor with 1.25-µm minimum feature sizes and a clock frequency of 10 MHz with a chip current of only 250 mA.