Morphological stability of copper-silver multilayer thin films at elevated temperatures

Abstract

The kinetics of breakdown of Cu-Ag polycrystalline multilayers during aging at elevated temperatures was investigated. Microlaminates with Cu:Ag layer thicknesses of 2:2, 1:4, 4:1, and 4:0.1 µm were aged for 10 minutes to 192 hours (t), at temperatures ranging from 700 to 900 K. The asdeposited microlaminates had a fine-grained columnar microstructure with well-defined interfaces. Upon annealing, the morphology evolved over three time regimes. In the first regime, the grains in each phase grew quickly to an apparent terminal size, which depended on both the layer thickness and annealing temperature. Next, grooves formed at the intersections of grain boundaries and layer interfaces and grew with a t0.25 dependence. The groove growth appeared to be independent of layer thickness and was approximately equal in Cu and Ag. The microlaminates started to break down in the third regime, as grain-boundary grooves on opposite sides of a layer bridged its thickness. Models for grain growth and grooving in thin films were modified for multilayer microlaminates and were shown to fit the experimental data reasonably well. This suggests that the terminal grain size is reached when groove drag overcomes the capillary forces driving grain growth, and that grooving kinetics are dominated by interfacial diffusion.