Abstract

This paper reports the result of investigation into the morphological evolution and migration of void in bi-piezoelectric material interface by utilizing nonlocal phase field model and finite element method (FEM), where the small scale effect containing the long-range forces among atoms is considered. The nonlocal elastic strain energy and the nonlocal electric energy around the void are firstly calculated by the finite element method. Then based on the finite difference method (FDM), the thermodynamic equilibrium equation containing the surface energy and anisotropic diffusivity is solved to simulate the morphological evolution and migration of elliptical void in bi-piezoelectric films interface. Results show that the way of load condition plays a significant role in the evolution process, and the boundary of void's long axis gradually collapses toward the center of ellipse. In addition, the evolutionary speed of left boundary gradually decreases with scale effect coefficient growth. This work can provide references for the safety evaluation of piezoelectric materials in micro electro mechanical system.

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