The evolution of void defects in metallic films based on a nonlocal phase field model

Abstract

In this paper, a nonlocal phase field method is presented to solve anisotropic diffusion-driven morphological evolution and migration of void defects in finite metallic film interconnects by utilizing a nonlocal phase field model considering a small scale effect. The nonlocal elastic theory is used to describe a small scale effect on the morphological evolution and migration of the void. In example calculations, the effects of the stress field, the electric field, and the anisotropic diffusion characteristic on the evolution of void defects in finite metallic film interconnects are described and discussed. The result in comparison with literature shows that the small scale effect based on nonlocal elastic model induces the migration diffusion of the crack tip to decrease.