Abstract
We have developed a new technique for monitoring the concentration of reaction products during puddle development in ultralarge-scale integration (ULSI) lithography. Optical measurement has been employed for monitoring the concentration of reaction products by detecting reflected light from a wafer surface, and compared with the sampling method (UV–visible spectroscopy) for reaction products from a developer solution. A correlation coefficient of 0.89 was obtained, indicating a good correlation between this optical method and sampling method. We concluded that the newly developed optical monitoring technique is useful for measuring the concentration of reaction products.
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