Abstract

Monitoring of Grinding Status of Alumina Grinding Wheel Based on Short-time Fourier Transform

Highlights

  • In recent years, due to the rapid development of science and technology, the requirements for high-precision components and molds have gradually increased

  • An accelerometer was installed on a computer numerical control (CNC) grinding machine, and the vibration signal of the accelerometer was processed by short-time Fourier transform (STFT) to observe the correlation between the wear behavior of the grinding wheel and the characteristic frequency during the grinding process

  • The accelerometers were placed on the spindle guard and the workbench to measure the vibration signal of the grinding wheel, and the vibration signal of the accelerometer was transformed to a time–frequency diagram by STFT

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Summary

Introduction

Due to the rapid development of science and technology, the requirements for high-precision components and molds have gradually increased. To enhance the use time and grinding accuracy of grinding wheels, Wu et al[10] and Srivastava et al[11] utilized a high-speed grinding machine to investigate the effects of the grinding force, temperature, and surface characteristics on the surface accuracy of the workpiece in the grinding of SiC materials. They compared the relationship between the real-time grinding force, temperature, and visual appearance of damage and debris in SEM micrographs. It was presumed that the self-sharpening phenomena could not perfectly repair the grinding wheel to its best state and that insufficient grinding ability caused the energy to surge

Experimental equipment
Setup of experimental equipment
Theoretical analysis of grinding and STFT
Theoretical analysis of continuous STFT
Results and Discussion
Characteristic frequency band of grinding wheel and workpiece
Surface roughness after grinding
Conclusions

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