Abstract
Commercialization of RF MEMS switches and the substitution for conventional gallium arsenide (GaAs) field-effect transistor (FET) and PIN diode switches is hindered by reliability problems and unpredictable switch failures during operation. Such failures are due partly to the fact that as the surface-to-volume ratio increases in MEMS devices, the surface forces become more dominant than the inertial effects, and thus significantly affect the performance and reliability of MEMS devices. Adhesion of the beam to the bottom dielectric surface (sometimes referred to as stiction in the literature) is the primary failure mechanism in MEMS devices in general and capacitive switches [4] in particular. Adhesion forces are mainly attributed to two phenomena; (1) mechanical deterioration of the contact surface with cycling [5], and (2) electrical charge trapping within the dielectric layer which induces electrostatic attraction [6]. One of the main difficulties in capacitive RF MEMS switch research is that these two effects are coupled and occur at the same time, which makes characterization of adhesion behavior of RF MEMS switches more complex, compared to metal switches, for example. Ref. [7] provides an overview of the major interfacial adhesion and tribological issues in MEMS.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.