Molecular dynamics simulations into rolling scraping of nickel-copper bilayer film

Abstract

Abstract In order to investigate the nanoscale friction mechanism and deformation behavior of nickel-copper bilayer film under rolling scraping, the effects of different factors during friction process such as the translation velocity, rotation velocity, radius of abrasive grain, contact depth, texture direction and crystallographic orientation are analyzed through molecular dynamics methods in terms of contact force, atomic lattice structure, internal substrate dislocation, kinetic energy and temperature. Results show that the contact force increases with the increase of the translation velocity or the decrease of the rotation velocity. Abrasive grains in a purely rolling state cause the most serious damage to the substrate. The contact force increases with the increase of contact depth or the decrease of abrasive grain radius, the amount of change in temperature and kinetic energy both increase with contact depth and abrasive radius. The crystallographic orientation has a significant effect on rolling scraping process and there is a crystallographic orientation with the minimum contact force. The degrees of substrate dislocation and the numbers of lattice reconstruction atoms under different factors and levels vary widely.