Abstract

We have investigated methods of preparing high quality Schottky contacts on grown on substrates. A new kind of surface treatment (2 nm cap layer, phosphoric acid‐based etching) before metal evaporation was developed. Barrier heights up to 0.73 eV and low leakage current densities of 0.22 μA/mm2 (about one order of magnitude lower than without treatment) have been attained. The quality and stability of these contacts where mainly affected by a surface treatment, but only a slight dependence on doping and on the choice of metallization was observed. Si‐doped and bulk material with different gallium contents are analyzed by deep level transient spectroscopy. Overlapping alloy broadened trap responses are separated by numerical spectrum analysis and reduction of the filling pulse width. We ascertained that the deep level concentration of is decreasing with increasing gallium content (by a factor of 2 from to ). This fact is associated with an improved crystalline quality of the quaternary material, compared to ternary , as demonstrated by narrow x‐ray diffraction peaks and photoluminescence linewidths.

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