Abstract
There is a reliability concern in the larger plastic surface mounting packages which can exhibit cracks from internal stresses during soldering. A lot of ad hoc information has been given to users of such packages about the origins of the problem and its alleviation. The phenomenon is the result of a combination of moisture absorbed in the plastic and the thermal stresses caused by the different expansions of the metal leadframe and the plastic. The work reported here gives quantitative data regarding the amount of moisture absorption critical to cracking, the range of baking procedures available to reduce this moisture below the critical level, and the acceptable floor life after baking for a wide range of storage temperatures and humidities.
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