Module and System Considerations to Maximize Performance Advantages of SiC Power Devices

Abstract

This paper extends a previously presented SiC power module design philosophy to critical, higher-level components for increased system performance, namely the DC bussing and DC link capacitor design. The DC bussing is essential to connect the DC bulk capacitors to the high-speed power modules and it is imperative that low inductance is maintained while current carrying capability and temperature be maintained. Often, high frequency capacitors are added to systems to increase performance by compensating for extra stray inductance that the DC bussing can introduce. However, issues that may arise by doing such are presented and it is shown that the best solution is to optimize the DC bus structure rather than compensate for a poor design. Finally, the implemented bussing is shown and full power system results presented for the inverter stack-up design.