Modulation of electrical properties of sputtered Ta2O5 films by variation of RF power and substrate temperature

Abstract

Dielectric thin films are important building blocks of microelectronic devices, and hence, research on the development of high-k dielectric thin films has drawn tremendous research interest. In this research, thin films of tantalum oxide (Ta2O5), a high-k dielectric material, are deposited on the Si substrate by the radio frequency (RF) magnetron sputtering technique. During the deposition of Ta2O5 thin film, the sputtering parameters such as sputtering power and substrate temperature were systematically varied, and post-deposition structural, morphological, and electrical properties of sputtered Ta2O5 films are studied by x-ray diffraction, Fourier transform infrared spectroscopy, atomic force microscope, capacitance–voltage (C-V) and current–voltage (I-V) measurement techniques. The annealed Ta2O5 thin film at the temperature of 900 °C for 1 h possesses polycrystalline nature with β—phase orthorhombic crystal structure. The film deposited at 150 W and substrate temperature at room temperature has shown comparatively lower surface roughness, which depicts the energy, and mobility of adatoms greatly influenced by RF power and substrate temperature. With the increase in sputtering power, the oxide charge density (Qox) is found to increase. On the other hand, Qox is found to decrease with the increase in substrate temperature. The film deposited at RF power of 150 W and substrate temperature of 300 °C is found to be of high dielectric constant, low oxide and interface charge density, and lower leakage current.