Abstract
This paper proposes a method for enhancing the adhesion strength between parylene C and the substrate by depositing a layer of Al2O3 film with residual tensile stress on parylene C by atomic layer deposition. Compared with pretreatment using a coupling agent, it improves the adhesion strength by 2.4 times. The parylene C/Al2O3 hybrid film maintains a good barrier performance after 10 000 times of bending with a bending radius of 3 mm, with the water vapor transmission rate (WVTR) retained at 3.55 × 10−4 g·m−2·d−1. Encapsulation of flexible organic light-emitting diodes is carried out using this hybrid film without a negative effect on the performance.
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