Abstract
Modified silyl-terminated polyether polymer (MS Polymer) was blended with bisphenol A diglycidyl ether (DGEBPA) epoxy at MS Polymer/epoxy ratio from 30/70 to 70/30. MS Polymer/epoxy systems were examined for two-component adhesive formulation with additional fillers. Applicability of the MS Polymer/epoxy system at the ratio of the components 60/40 is demonstrated for the development of adhesive formulation. Rheological analysis of the components A and B shows suitable viscosity values for development of two- component adhesives formulation. Curing dynamics as well as tensile stress-strain properties and Shore A hardness of the chosen adhesive formulation are reasonable for the development of MS Polymer/epoxy type adhesive.
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