Modified Hot-Zone Design of Growth Cell for Reducing the Warpage of 6”-SiC Wafer

Abstract

The modified hot-zone design, consisting of a new design and new materials for the backside of SiC seed holder was adopted for reducing stress in grown SiC crystal ingot and for reducing the warpage of 6-inch SiC wafer. Crucible lid on the backside of SiC seed holder was designed to be movable during the growth process. Based on the warp value and mapping measurement of FWHM (Full width at half maximum) value in X-ray rocking curve, the crystal quality of SiC crystals grown with new hot-zone design was observed to be better than conventional design.