Modification of two-component bismaleimide resin by blending (meth)allyl compounds as third components

Abstract

A two-component bismaleimide resin composed of 4,4′-bismaleimidediphenyl methane (BDM) and o,o′-diallyl bisphenol A (DBA) (Matrimid 5292 resin) was used as a parent bismaleimide resin. Modification of the parent bismaleimide resin was examined using several kinds of (meth)allyl compounds as the third component. The (meth)allyl compounds include triallyl isocyanurate (TAIC), o,o′-dimethallyl bisphenol A (DMBA) and trimethallyl isocyanurate (TMAIC). In the ternary BDM/DBA/TAIC blends, the fracture toughness KIC and flexural strength for the cured resins decreased with increasing TAIC content; thermal properties of the cured resins were not deteriorated. In the ternary BDM/DBA/DMBA blends, KIC and flexural modulus for the cured resins increased and their glass transition temperatures decreased with an increase in DMBA content. Flexural strength increased up to DMBA 70 eq% blend and then decreased. In the ternary blend of BDM/DBA/TMAIC (1.0/0.5/0.5), KIC for the blend increased 15%, with retention of flexural property and Tg. In the ternary BDM/DMBA/TMAIC (1.0/0.5/0.5) blend, the cured resin had balanced properties and its KIC increased 50% compared to the cured Matrimid resin. © 1999 Society of Chemical Industry