Abstract
The purpose of this paper is to modify the resin binder for developing resin-bonded diamond wire saw. The optimization of components with different ratios in the resin binder was investigated using orthogonal design experiments. Besides, the resin-bonded diamond wire saw was developed using the piano wire (the diameter is 0.2mm), the modified resin and the diamond abrasive (the diameter is 20~30μm). Good surface quality and slicing performance were obtained when slicing silicon crystal using the resin-bonded diamond wire saw we made in the experiments.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Published version (
Free)
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
