Model-to-hardware correlation of disk resonators for via-array modeling in high-speed PCBs

Abstract

In high-speed printed circuit board (PCB) designs, vias play a critical role in determining signal and power integrity. This paper uses disk resonators to investigate modeling approaches for common via array structures. Boundary integral equation (BIE) and effective dielectric medium approaches are used for a perforated disk resonator with non-plated holes, using dielectric properties derived from a solid disk resonator study. Both approaches are compared and validated with measurements.