Modelling of passive heating for replication of sub-micron patterns in optical disk substrates

Abstract

The transcribability of pit or land groove structures in replicating an optical disk substrate greatly affects the performance of a high-density optical disk. However, a solidified layer generated during the polymer filling worsens transcribability because the solidified layer prevents the polymer melt from filling the sub-micron patterns. Therefore, the development of the solidified layer during the filling stage of injection moulding must be delayed. For this delay, passive heating through an insulation layer has been used. In the present study, to examine the development of the solidified layer, delayed by passive heating, the flow of the polymer melt with passive heating was analysed. Passive heating delayed markedly the development of the solidified layer, reduced the viscosity of the polymer melt, and increased the fluidity of the polymer melt in the vicinity of the stamper surface with the sub-micron patterns. As a result, we predict that passive heating can improve the transcribability of an optical disk substrate. To verify our prediction, we fabricated an optical disk substrate by using passive heating of a mould and measured the transcribability of an optical disk substrate.