Modelling of parameters for asymmetric halo and symmetric DHDMG n-MOSFETs

Abstract

This article presents an analytical surface potential, threshold voltage and drain current model for asymmetric pocket-implanted, single-halo dual material gate and double-halo dual material gate (DHDMG) n-MOSFET (MOSFET, metal–oxide–semiconductor field-effect transistor) operating up to 40 nm regime. The model is derived by applying Gauss's law to a rectangular box, covering the entire depletion region. The asymmetric pocket-implanted model takes into account the effective doping concentration of the two linear pocket profiles at the source and the drain ends along with the inner fringing capacitances at both the source and the drain ends and the subthreshold drain and the substrate bias effect. Using the surface potential model, the threshold voltage and drain currents are estimated. The same model is used to find the characteristic parameters for dual-material gate (DMG) with halo implantations and double gate. The characteristic improvement is investigated. It is concluded that the DHDMG device structure exhibits better suppression of the short-channel effect (SCE) and the threshold voltage roll-off than DMG and double-gate MOSFET. The adequacy of the model is verified by comparing with two-dimensional device simulator DESSIS. A very good agreement of our model with DESSIS is obtained proving the validity of our model used in suppressing the SCEs.