Abstract
Abstract A computational model is developed to include heat transfer, effects of resistance of the metal–mould interface, and pressure in the simulation of the solidification process. The simulation of the interface resistance is based on the Zero Thickness Element, utilizing the Finite Element Method. The solid boundary conditions, including contact resistances, have been modified by a pressure gradient in each of the Zero Thickness Elements. The pressure gradient has been modelled on experimental data. In order to verify the computational results, an Al-11.5wt.% Si alloy has been poured into a permanent mould and the temperature of the interface measured. Then we modelled the effect of metallostatic pressure on the overall heat transfer coefficient in the metal–mould interface. The comparison between the experimental and the simulation results during the solidification process shows a good consistency that confirms the accuracy of the model for the effect of the interface resistance on solidification time.
Published Version
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