Abstract
We represent the modelling of a thermoelectric cooler, which is designed by using micromachining and thin film technology. The cooler fabrication is compatible with standard semiconductor technology. Therefore, it can be integrated in microelectronic circuits. The most important parameters of the device like cooling power, maximum temperature difference and optimum current density are calculated. By using thermoelectric thin films with high efficiency and very thin SiC/Si 3N 4-membranes, a cooling power of a few milliWatts or maximum temperature difference of 30–50 K can be achieved.
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