Abstract
An improved model for surface evolvement of Deep Reactive Ion Etching (DRIE) is developed, which is based on Time Multiplexed Deep Etching (TMDE). It couples the advanced plasma sheath approximation and has the simplex data structure due to 2D string algorithm, so as to achieve an acceptable arithmetic speed. Furthermore, after some reasonable descriptions for footing surface are assumed, a simple module for footing effect simulations is added to this model. The simulations of DRIE and footing effect are also performed, and the simulated results are in accordance with the experiments.
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