Modelling and analysis of the bonding mechanism of CBN grains for electroplated superabrasive tools—part 1: introduction and application of a novel approach for determining the bonding force and the failure modes

Abstract

This series of papers provides an in-depth analysis of the failure mode of the electroplated bond for single-layer superabrasive products, e.g., electroplated cubic boron nitride (CBN) wheels, diamond wire saw, and electroplated diamond dresser. The bonding force of the electroplated grinding tools is the primary factor that dominates the grinding quality and tool life in high-end applications. Therefore, the understanding and characterization of the bonding mechanism of the electroplated layer is of great importance for improving efficiency and quality in the applications of these abrasive products. In this first part, the experimental setup similar to an inclined microthreading process is designed to observe and measure the failure mode and maximum bonding force of the electroplated layer, respectively. The failure mode is analyzed by comparing the morphology before and after the high-speed bonding force test for electroplated layer. In the subsequent second part, a qualitative relationship is established between the maximum bonding force and the bonding layer thickness through the response surface method and experimental verification.