Abstract
This paper is the second part of the series of papers, which establishes the finite element model (FEM) of single grain cubic boron nitride (CBN) bonding for quantitative analysis and optimization of the bonding force. The FEM model of the bonding force involves the geometric modelling of the bonding couple, the determination of the mechanical properties of the electroplating layer, and the development of the algorithm for CBN grain dislodgement. By modelling the actual grain shape and bond material, the FEM model is verified through the bonding force experiments based on the inclined micro-cutting test as of part 1. Finally, the comprehensive correlation of the bonding force with the bonding layer thickness and grain orientation is established through response surface methodology.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: The International Journal of Advanced Manufacturing Technology
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
