Abstract
In this paper, the use of the transmission line matrix (TLM) method for the treatment of thermal effects in nanoscale systems is discussed. A new approach is presented, which combines the modeling of thermal diffusion and radiation effects using emissivity in a 1-D TLM model. This paper shows the suitability of using the TLM to model the heat dissipation in nanoscale engineering components. It offers an appropriate solver for thermal applications, such as heat dissipation, in nanodevices. Two types of nanowires are simulated to demonstrate the behavior of the proposed approach.
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