Abstract
A core-shell microstructure is adopted to account for the unique resistivity-temperature (ρ–T) behavior of (Pb0.6Sr0.4)TiO3 materials prepared by the rapid thermal sintering (RTS) process. Instead of a V–shaped temperature coefficient of resistivity (VTCR) with critical temperature (T′c1) at around 220°C, commonly observed for the materials prepared by conventional sintering process, a ρ–T curve with single high Tc2\\cong440°C is obtained. Moreover, the cooling rate after the RTS process markedly influences the ρ–T behavior. The apparent resistivity and the negative temperature coefficient of resistivity (NTCR) decrease as the cooling rate increases. The critical temperature (Tc2) for abrupt resistivity jump is insignificantly varied. These phenomena are ascribed to the modification of the thickness of the shell region due to the interdiffusion between the core and shell materials during the cooling stage. A simplified microstructural model is used to simulate the temperature dependence of resistivity and clearly explains the electrical behavior of these RTS samples.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
